Ukukhiqizwa kwe-PCB
Ukukhiqizwa kwe-PCB kubhekisela kunqubo yokuhlanganisa ama-conductive traces, insulating substrates, nezinye izingxenye zibe ibhodi lesekethe eliphrintiwe elinemisebenzi ethile yesekethe ngochungechunge lwezinyathelo eziyinkimbinkimbi.Le nqubo ihilela izigaba eziningi ezifana nokuklama, ukulungiswa kwempahla, ukumba, i-copper etching, i-soldering, nokuningi, okuhloswe ngayo ukuqinisekisa ukuzinza nokuthembeka kokusebenza kwebhodi lesifunda ukuze kuhlangatshezwane nezidingo zemishini kagesi.Ukukhiqizwa kwe-PCB kuyingxenye ebalulekile embonini yokukhiqiza kagesi futhi kusetshenziswa kakhulu emikhakheni eyahlukene efana nezokuxhumana, amakhompyutha, kanye nogesi wabathengi.
Uhlobo Lomkhiqizo
Ibhodi lesifunda eliphrintiwe le-TACONIC
Optical wave ukuxhumana PCB board
Rogers RT5870 high-frequency board
I-TG ephezulu kanye ne-high-frequency Rogers 5880 PCB
Ibhodi le-PCB yokulawula izingqimba eziningi
4-ungqimba FR4 PCB
Imishini yokukhiqiza ye-PCB
Ikhono lokukhiqiza i-PCB
Imishini yokukhiqiza ye-PCB
Ikhono lokukhiqiza i-PCB
| into | Amandla okukhiqiza |
| Inombolo yezendlalelo ze-PCB | 1 ~ 64th floor |
| Izinga lekhwalithi | Uhlobo lwekhompyutha yemboni 2|IPC uhlobo 3 |
| I-Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen mahhala njll. |
| Imikhiqizo ye-laminate | Kingboard|I TEQ|shegnyi|Nanya|lsola |TUC |S YL|Arlon|Nel co |I-Taconic |H i ta chi|Rogers et al. |
| izinto zokushisa eziphezulu | I-Tg Ejwayelekile: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kunqubo engenamthofu) |
| I-Tg Ephakathi: I-HDI, izendlalelo eziningi: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakeme: Ithusi eliwugqinsi, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|I-SYS1165 | |
| Ibhodi lesekhethi ephezulu | Rogers|I-Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Inombolo yezendlalelo ze-PCB | 1 ~ 64th floor |
| Izinga lekhwalithi | Uhlobo lwekhompyutha yemboni 2|IPC uhlobo 3 |
| I-Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen mahhala njll. |
| Imikhiqizo ye-laminate | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co |I-Taconic |H i ta chi|Rogers et al. |
| izinto zokushisa eziphezulu | I-Tg Ejwayelekile: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kunqubo engenamthofu) |
| I-Tg Ephakathi: I-HDI, izendlalelo eziningi: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakeme: Ithusi eliwugqinsi, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|I-SYS1165 | |
| Ibhodi lesekhethi ephezulu | Rogers|I-Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Inombolo yezendlalelo ze-PCB | 1 ~ 64th floor |
| Izinga lekhwalithi | Uhlobo lwekhompyutha yemboni 2|IPC uhlobo 3 |
| I-Laminate/Substrate | FR-4|S1141|High Tg|PTFE|CeramIC PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon Ha logen mahhala njll. |
| Imikhiqizo ye-laminate | Kingboard|I TEQ|Sheng Yi|Nanya|lsola |TUC |S YL|Arlon|Nel co |I-Taconic |H i ta chi|Rogers et al. |
| izinto zokushisa eziphezulu | I-Tg Ejwayelekile: S1141|KB6160|I-Huazhen H14 0 (ayisebenzi kunqubo engenamthofu) |
| I-Tg Ephakathi: I-HDI, izendlalelo eziningi: SY S1000H |ITEQI T158 |HuazhengH150|TU-662 |SY S1150G|HuazhengH150HF|H160HF; | |
| I-Tg Ephakeme: Ithusi eliwugqinsi, ukuphakama okuphezulu ：SY S1000-2|I TEQIT180A|HuazhengH170|ISOLA : FR408R |370HR|TU-752|I-SYS1165 | |
| Ibhodi lesekhethi ephezulu | Rogers|I-Arlon|Taconic|SY SCGA-500|S7136|Huazheng H500C |
| Ukujiya kwepuleti | 0.1 ~ 8.0mm |
| Ukubekezelelana kokuqina kwepuleti | ±0.1mm/±10 % |
| Ubuncane besisekelo sogqinsi lwethusi | Isendlalelo sangaphandle : 1/3oz(12um)~ 1 0oz |Isendlalelo sangaphakathi: 1/2oz~6oz |
| Ubukhulu obuqediwe bethusi obukhulu | 6 amawunsi |
| Ubuncane bosayizi wokumba wemishini | 6mil(0.15mm) |
| Ubuncane bosayizi wokumba we-laser | 3 million (0 . 075mm) |
| Ubuncane bosayizi wokumba we-CNC | 0.15mm |
| Ubulukhuni bembobo yodonga (ubuningi) | 1.5 million |
| Ubuncane bokulandela ububanzi/isikhala (ungqimba lwangaphakathi) | 2/2mil (Outer l ayer :1 /3oz, Inner l ayer: 1/2oz) (H/H OZ base copper) |
| Ubuncane bokulandela ububanzi/isikhala (ungqimba lwangaphandle) | 2.5/2.5mi l (H/H OZ base copper) |
| Ibanga elincane phakathi kwembobo ne-conductor yangaphakathi | 6000000 |
| Ibanga elincane ukusuka embobeni ukuya kumkhondatha wangaphandle | 6000000 |
| Ngendandatho encane | 3000000 |
| Imbobo yengxenye ubuncane indilinga yembobo | 5000000 |
| Ubuncane be-BGA ububanzi | 800w |
| Isikhala esincane se-BGA | 0.4mm |
| Irula yembobo encane eqediwe | 0.15m m(CNC) |0. 1mm(i-laser) |
| uhhafu wembobo ububanzi | Ububanzi bembobo encane kunazo zonke: 1mm, i-Half Kong iwumsebenzi owodwa okhethekile, Ngakho-ke, ububanzi bembobo obuyingxenye kufanele bube bukhulu kuno-1mm. |
| Imbobo yodonga lwethusi ubukhulu (thinnest) | ≥0.71 million |
| Ugqinsi lwethusi lwembobo (isilinganiso) | ≥0.8 million |
| Igebe lomoya elincane | 0.07 mm (3 million) |
| I-asphalt yomshini wokubeka omuhle | 0. 07 mm (3 million) |
| ubukhulu be-aspect ratio | 20:01 |
| Ububanzi obuncane bebhuloho lemaski ye-solder | 3000000 |
| I-Solder Mask/Izindlela Zokwelapha Isekhethi | ifilimu | LDI |
| Ubuncane bogqinsi bongqimba bokufakelwa | 2 million |
| I-HDI nohlobo olukhethekile lwe-PCB | I-HDI (izinyathelo ezingu-1-3) |I-R-FPC(izendlalelo ezingu-2-16)丨Ingcindezi exubile yefrikhwensi ephezulu(2- 14th floor)丨Amandla Okungcwatshwa Nokumelana… |
| esiphezulu.I-PTH (imbobo eyindilinga) | 8 mm |
| esiphezulu.I-PTH (imbobo ecijile eyindilinga) | 6*10mm |
| Ukushintsha kwe-PTH | ±3mil |
| Ukuchezuka kwe-PTH (ububanzi | ±4mil |
| Ukuchezuka kwe-PTH (ubude) | ±5mil |
| Ukuchezuka kwe-NPTH | ±2mil |
| Ukuchezuka kwe-NPTH (ububanzi) | ±3mil |
| Ukuchezuka kwe-NPTH (ubude) | ±4mil |
| Ukuchezuka kwendawo yembobo | ±3mil |
| Uhlobo lomlingiswa | inombolo ye-serial |ibhakhodi |Ikhodi ye-QR |
| Ubuncane bezinhlamvu zobubanzi (i-legend) | ≥0.15mm, ububanzi bezinhlamvu obungaphansi kuka-0.15mm ngeke bubonwe. |
| Ubude obuncane bezinhlamvu (i-legend) | ≥0.8mm, ubude bezinhlamvu obungaphansi kuka-0.8mm ngeke bubonwe. |
| Ukubukeka kwesilinganiselo sohlamvu (i-legend) | I-1:5 kanye ne-1:5 yizilinganiso ezifanele kakhulu zokukhiqiza. |
| Ibanga phakathi kwe-trace ne-contour | ≥0.3mm (12mil), ibhodi elilodwa lithunyelwe : Ibanga phakathi kwe-trace kanye ne-contour yi-≥0 .3mm , ithunyelwe njengebhodi lephaneli eline-V-cut : Ibanga phakathi komkhondo nomugqa we-V-cut ngu-≥0 .4mm |
| Alikho iphaneli yesikhala | 0mm, Ithunyelwe njengephaneli , Isikhala samapuleti singu-0mm |
| Amaphaneli anezikhala | 1.6m m, qinisekisa ukuthi ibanga phakathi kwamabhodi ≥ 1 .6mm, kungenjalo kuyoba nzima ukucubungula nocingo. |
| ukwelashwa kwendawo | TSO|HASL|HASL(HASLLF) engenamthofuENEP IG|Goldfinger+HASL|ENIG+OSP |ENIG+Gold Finger|OSP+Gold Finger, njll. |
| I-Solder Mask Finishing | (1) .Ifilimu emanzi (imaski ye-L PI solder) |
| (2) .Imaski ye-solder ecwecwayo | |
| Umbala wemaski we-Solder | okuluhlaza |obomvu |Mhlophe |blue blue |yellow |umbala osawolintshi |Okunsomi, okumpunga |Ukungafihli njll. |
| okuluhlaza :okuluhlaza|blue |Mnyama njll. | |
| Umbala wesikrini sikasilika | omnyama |Mhlophe |ophuzi njll. |
| Ukuhlolwa kukagesi | I-Fixture/Flying Probe |
| Okunye ukuhlolwa | I-AOI, i-X-Ray (AU&NI), ukulinganisa okunohlangothi olubili, imitha yethusi yembobo, ukuhlolwa kwe-impedance okulawulwayo (Ukuhlolwa kwekhuphoni&Umbiko Weqembu Lesithathu) , isibonakhulu se-metallographic, isihloli samandla ekhasi, ukuhlolwa kocansi okushiselayo, ukuhlola ukungcoliswa kwengqondo |
| i-contour | (1).Izintambo ze-CNC (±0.1 mm) |
| (2).CN CV uhlobo lokusika (±0 .05mm) | |
| (3) .i-chamfer | |
| 4) .Ukushaya isikhunta (±0 .1 mm) | |
| amandla akhethekile | Ithusi eliwugqinsi, igolide eliwugqinsi (5U”), Umunwe wegolide, imbobo eyimpumputhe egqitshiwe, ICountersink, imbobo ewuhhafu, ifilimu exebuka, uyinki wekhabhoni, imbobo ecwebile, imiphetho yamapuleti afakwe ugesi, izimbobo zokucindezela, imbobo yokulawula, i-V ku-PAD IA, engaqhubeki imbobo yepulaki ye-resin, imbobo yepulaki ene-electroplated, Ikhoyili PCB, i-Ultra-miniature PCB, imaski exebuka, i-PCB ye-impedance elawulekayo, njll. |
